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Custom RFM300 ISM Transceiver Module 433MHZ 868MHZ 915MHZ Design of CMT2300 chip based on CMOS TEK NextGenRFTM
Custom RFM300 ISM Transceiver Module 433MHZ 868MHZ 915MHZ Design of CMT2300 chip based on CMOS TEK NextGenRFTM
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RFM300H/RFM300
ISM Transceiver Module With +20dBm (100mW) Output Power
(The purpose of this RFM300H/RFM300 speccovers mainly for the hardware and RF parameterinfo of the module, For software info please refer toCMT2300 chip datasheets and demo program of HopeDuino™ Develo -pmentKit)
1. General Introduction
RFM300H/RFM300module series’ design is based on the high performanceCMOSTEK NextGenRFTM CMT2300 chip, Itoperate at 433/868/915MHz ISM band , The low receive sensitivity(–120dBm) coupled with +20dBm (RFM300H)/+13dBm(RFM300) output power ensures extended range and improved link performance.
2. Features
140dB maximum link budget.
Low RX current of 7mA.
+20 dBm output power @RFM300H; +13 dBm output power @RFM300.
Programmable bit rate up to 300 kbps@FSK/40 kbps@OOK
High sensitivity: down to -120dBm.
FSK, GFSK, and OOK modulation.
SMD Package (16x16X1.8mm)
3. Application
Meter Reading
Wireless data collection
Automobile security system
Home automation and security system
4. Pin Definition
4.1 RFM300H Pin Definition


4.2 RFM300 Pin Definition


Notes:
[1]. INT1 and INT2 are interrupts. DOUT is demodulated output. DIN is a modulation input. DCLK is a modulation or demodulation data rate synchronization clock, automatic switching in TX/RX mode.
[2]. The SCLK pin connects an internal pull-down resistor of 4.7 kΩ inside the chip. Thus in low-power applications, the MCU cannot output high level (pull up), otherwise it will generate leakage current and will cause low-power implementation failure.
[3]. The SDIO pin connects an internal pull-up resistor of 15 kΩ inside the chip. Thus in low-power applications, the MCU cannot output low level (pull down), otherwise it will generate leakage current and will cause low-power implementation failure. The GPIO pins connect an internal pull-up resistor of 15 kΩ inside the chip. Thus in low-power applications, the MCU cannot output low level (pull down), otherwise it will generate leakage current and will cause low-power implementation failure.
5. Electrical Parameter:
Maximum

Recommended Working Range

DC Characteristic

Transmitter AC Characteristic

Receiver AC Characteristic

6. Typical Application:


(For software info please refer to CMT2300 chip datasheets and demo program of HopeDuino™ Development Kit)
7. Mechanical Dimension
(All units in mm)


8. Order Information

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