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Custom PCBA OKMX8MP-C Single Board Computer NXP iMX8M Plus Manufacturer

Custom PCBA OKMX8MP-C Single Board Computer NXP iMX8M Plus Manufacturer

Regular price $100.00 USD
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OKMX8MP-C Single Board Computer

OKMX8MP-C single board computer(SBC) is powered by the high-performance processor, NXP i.MX 8M Plus , built-in NPU, ISP, AI computing capacity up to 2.3TOPS, can meet most compact Edge AI Solution. The flexible I/O interfaces are convenient for users' application developments. The SBC supports 2 Gigabit Ethernet, 2 CAN-FD, 4 UART, 4G, 5G, dual-band WiFi, PCIe3.0, USB3.0, HDMI2.0, LVDS, MIPI_CSI, MIPI_DSI and other interfaces. Industrial-grade design with ESD,EMI solutions, OKMX8MP-C is widely used in various fields, such as smart cities, industry 4.0, smart medical devices, intelligent transport and other applications.

Features

  • 1. a Neural Processing Unit (NPU) operating at up to 2.3 TOPS;

  • 2. Dual Image Signal Processor (ISPs): Resolution up to 12MP and input rate up to 375MPixels/s;

  • 3. Powerful quad Arm® Cortex®-A53 processor plus real-time control with Cortex-M7, up to 800MHz;

  • 4. Robust control networks supported by dual CAN FD and dual Gigabit Ethernet with Time Sensitive Networking (TSN);

  • 5. Dual 8LVDS display.

Advantages Of OKMX8MP-C Single Board Computer

  • 1. UBOOT adds MIPI and LVDS display drivers;

  • 2. Increase UBOOT LOGO Keep function;

  • 3. Increase UBOOT's use of the kernel device tree to configure hardware functions;

  • 4. Adapt to the WIFI module, and solve a series of bugs in the module;

  • 5. Fix a series of problems in the three-screen display and HDMI startup and plug-in process.

iMX8M Plus Core Board Features:

  • 1. EEPROM chip is reserved on the core board to ensure hardware consistency;

  • 2. The core board adopts LPDDR4, up to 8MP, 4GT/S;

  • 3. Some high-speed signal circuits of LPDDR4 have passed the simulation test, and the stability is guaranteed;

  • 4. The bottom structure considers the shell and industry design, which is convenient for productization;

  • 5. The communication interface considers EMC protection requirements, and adds static electricity and isolation design.

 

Industrial-grade system on module with high performance and low power cons

High-speed Communication Interface

4K picture quality and HiFi voice experience

The HDMI interface supports up to 4K display output;
it also has LVDS, MIPI-DSI display interfaces, and can support three display interfaces, three screens with the same display, and three screens with different displays;

The latest audio technology, Cadence® Tensilica® HiFi 4 DSP @ 800 MHz, 6x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-channel PDM microphone input, eARC, ASRC.

Advanced Multimedia Technology

3D/2D Graphics Acceleration

Machine Learning And Vision

Built-in NPU, AI computing capability 2.3TOPS, meeting the needs of lightweight edge computing

Built-in image signal processor (ISP)

High version and high stability operating system

Industrial grade quality

Industrial-grade temperature width test -40℃~+85℃ (except WiFi module) Communication interface static electricity level 4 and 1.5KV isolation protection

Rich communication interface

Flexible optional wireless module

Support dual-band WiFi, 4G module, 5G module with SDIO3.0 interface

Interface resources

Product Applications

 

 
 

 

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