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Lonten Tech

Custom PCBA Core-3588J Firefly RK3588 Rockchip Manufacturer

Custom PCBA Core-3588J Firefly RK3588 Rockchip Manufacturer

Regular price $100.00 USD
Regular price $0.00 USD Sale price $100.00 USD
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Specifications

Basic Specifications

SOC

RockChip RK3588

CPU

8-core 64-bit (4×Cortex-A76+4×Cortex-A55) , 8nm lithography process, frequency up to 2.4GHz

GPU

ARM Mali-G610 MP4 quad-core GPU

Supports OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS

NPU

NPU computing power is up to 6 TOPS, Supports INT4/INT8/INT16 mixed operation,

Supports framework switching of TensorFlow / MXNet / PyTorch / Caffe / etc.

ISP

Integrated 48MP ISP with HDR&3DNR

VPU

Video decoding:

8K@60fps H.265/VP9/AVS2

8K@30fps H.264 AVC/MVC

4K@60fps AV1

1080P@60fps MPEG-2/-1/VC-1/VP8

Video encoding:

8K@30fps encoding, Supports H.265 / H.264

* Achieves up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding

RAM

4GB/8GB/16GB 64bit LPDDR4/LPDDR4x/LPDDR5 (Up to 32GB optional)

Storage

16GB/32GB/64GB/128GB eMMC

Hardware Specifications

Network

Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet,
WiFi 6/BT, 5G/4G LTE

Display

Video output:

1 × HDMI2.1 ( 8K@60fps or 4K@120fps)

1 × HDMI2.0 ( 4K@60fps)

2 × MIPI-DSI ( 4K@60fps)

2 × DP1.4 ( 8K@30fps, multiplexed with USB3.0)

2 × eDP1.3 ( 4K@60Hz)

1 × BT.1120 ( 1080@60fps)

Video input:

1 × HDMI-IN ( 4K@60fps) , supports HDCP 2.3

1 × MIPI CSI (4 lanes) or 2×MIPI CSI (2 lanes)

2 × MIPI DC ( 4-lane DPHY v2.0 or 3-lane CPHY V1.1)

1 × DVP camera (up to 150MHz input data)

* Supports multi-channel 8K video output and 4K video input,

up to seven-screen output with different displays

Audio

2 × 8-channel I2S

2 × 2-channel I2S

2 × SPDIF

2 × 8-channel PDM (supports multi-MIC array)

1 × Dual-channel digital audio codec (16-bit DAC)

1 × VAD

PCIE

PCIe3.0 (2×2lanes,1×4lanes,4×1lanes) 、3×PCIE2.0(1 lanes)

SATA

3 × SATA3.0

USB

3 × USB3.0、4 × USB2.0 Host 2 × USB2.0 OTG

Power

4V (error±5%)

Other Interfaces

9 × I2C、10 × UART、5 × SPI、7 × ADC 、16 × PWM 、1 × SDMMC、GPIO

OS/Software

OS

Android: Android 12.0

Linux: Ubuntu Desktop, Ubuntu Server, Debian11, Buildroot, RTLinux, Kylin Linux, UOS

* Supports UEFI Boot

General

Size

82 mm × 53 mm

Interface Type

MXM3.0 ( 314 PIN, 0.5mm pitch)

PCB

10-layer design, immersion gold technology

Heat Dissipation

Heat sink installation hole pitch: 45mm

Power Consumption

Idle: ≈1.35W (12V/110mA)

Typical: ≈4.8W (12V/400mA)

Max: ≈20W (12V/1700mA)

Environment

Operating Temperature: -20℃-60℃,

Storage Temperature: -20℃-70℃,

Storage Humidity: 10%-80%

 

 

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