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Custom Custom PCB circuit board pcba Jetson AGX Xavier Developer Kit demoboard 8-core ,64-bit CPU,32GB+32GB eMMC Manufacturer

Name: Custom Custom PCB circuit board pcba Jetson AGX Xavier Developer Kit demoboard 8-core ,64-bit CPU,32GB+32GB eMMC Manufacturer
Brand: Lonten Tech
Price: 100.00 USD
Availability: InStock

$100.00 USD

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With the NVIDIA Jetson AGX Xavier developer kit, you can easily create and deploy end-to-end AI robotics applications for manufacturing, delivery, retail, agriculture, and more.

Supported by NVIDIA JetPack and DeepStream SDKs, as well as CUDA®, cuDNN, and TensorRT software libraries, the kit provides all the tools you need to get started right away. And because it’s powered by the new NVIDIA Xavier processor, you now have more than 20X the performance and 10X the energy efficiency of its predecessor, the NVIDIA Jetson TX2.

Get started today with the Jetson AGX Xavier Developer Kit. The Jetson Development Pack (JetPack) is an on-demand, all-in-one package that bundles and installs all software tools required to develop for the NVIDIA Jetson embedded platform.JetPack includes tools for:Deep Learning: TensorRT, cuDNN, NVIDIA DIGITS™ WorkflowComputer Vision: NVIDIA VisionWorks, OpenCVGPU Compute: NVIDIA CUDA, CUDA LibrariesMultimedia: ISP Support, Camera imaging, Video CODECIt also includes ROS compatibility, OpenGL, advanced developer tools, and much more.

A SMALL BREAKTHROUGH IN EMBEDDED APPLICATIONS

At just 100 x 87 mm, Jetson AGX Xavier offers big workstation performance at 1/10 the size of a workstation. This makes it ideal for autonomous machines like delivery and logistics robots, factory systems, and large industrial UAVs.

TAKING PERFORMANCE TO THE EDGE

As the world’s first computer designed specifically for autonomous machines, Jetson AGX Xavier’s high performance can handle the visual odometry, sensor fusion, localization and mapping, obstacle detection, and path planning algorithms critical to next-generation robots. Get GPU workstation-class performance with an unparalleled 32 TeraOPS (TOPS) of peak compute and 750 Gbps of high-speed I/O in a compact 100 x 87 mm form factor.

THE POWER OF FLEXIBILITY

Users can configure operating modes at 10 W, 15 W, and 30 W as needed for their applications, enabling new levels of compute density, energy efficiency, and AI inferencing capabilities at the edge.